HiSilicon, Huawei’s chip subsidiary, will be the first customer to use a TSMC process using EUV, reports China’s Commercial Times.
The process labelled N7 Plus, is due for production in Q1 2019.
A follow-up process using EUV, N5, is due for production in 2020.
Huawei is TSMC’s second largest customer after Apple.
TSMC is expected to be the first company in the world to use EUV for mass production with Samsung second.