Vishay has released a series of surface-mount device (SMD) thermal jumper chip that transfer heat from electrically isolated components by providing a thermal conductive pathway to a ground plane or common heatsink.
Called THJP and branded ThermaWick, they have an aluminium nitride substrate with 170W/mK thermal conductivity.
By pulling heat across the electrical isolation barrier, they reduce the temperature of the heat-producing component and “this reduction allows designers to increase the power handling capability of these devices or extend their useful life at existing operating conditions while maintaining the electrical isolation of each component”.
Capacitance is as small as 0.07pF, allowing high-frequency use.
| Case size |
Thermal resistance |
Thermal conductance |
Capacitance |
| 0603 | 14°C/W | 70mW/°C | 0.07pF |
| 0612 | 4 | 259 | 0.26 |
| 0805 | 13 | 77 | 0.15 |
| 1206 | 15 | 65 | 0.07 |
| 1225 | 4 | 259 | 0.26 |
| 2512 | 15 | 65 | 0.07 |
0612 and 1225 sizes have long side terminations for additional heat transferring capability.
Custom sizes are also available.
Pb-inclusive or Pb-free wraparound terminations are available.
Applications are foreseen in power supplies, power converters, RF amplifiers, synthesizers, pin diodes, laser diodes, and filters – in AMS, industrial, and telecommunications.
Source: electronicsweekly
